Details

Patent
Patent Number
US7179693
Title
Method for manufacturing thin film device that includes a chemical etchant process
Assignee
sony corporation
patentAbstract
The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (10
publisherAbstract
Rating
3.4
Tier
3

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